Одномодульные компьютеры COM Express Type 7 Basic module with Intel Atom C3858 processor with 12 Cores, 2.0GHz core frequency, 12MB Cache, Intel Cache Allocation Technology and 2400 MT/s dual channel DDR4 memory interface for up to 48GB SODIMM ECC memory.
Одномодульные компьютеры COM Express Type 7 Basic module with Intel Atom C3958 processor with 16 Cores, 2.0GHz core frequency, 16MB Cache, Intel Cache Allocation Technology and 2400 MT/s dual channel DDR4 memory interface for up to 48GB SODIMM ECC memory.
Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu =
Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu =
Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP
Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP
Системы охлаждения для ЦП и чипов Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B =
Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = co
Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W *
Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W *
Радиаторы Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for modules with TDP up to 17W * Cu = Copper plate * B = Bore hole standoffs
Радиаторы Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for versions up to 17W TDP * Cu = Copper plate * T = M2.5 threaded standoffs
Радиаторы Standard heatspreader for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber. Intended for modules with TDP higher than 17W *VC = Vapor Chamber *B = 2.7mm bore hole standoffs
Радиаторы Standard heatspreader for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber. Intended for modules with TDP higher than 17W *VC = Vapor Chamber *T = M2.5 threaded stand-offs
Одномодульные компьютеры COM Express Type 7 Basic module with Intel Atom C3508 processor with 4 Cores, 1.6GHz core frequency, 8MB Cache, Intel Cache Allocation Technology and 1866 MT/s dual channel DDR4 memory interface for up to 48GB SODIMM ECC memory. F
Одномодульные компьютеры COM Express Type 7 Basic module with Intel Atom C3708 processor with 8 Cores, 1.7GHz core frequency, 16MB Cache, Intel Cache Allocation Technology and 2133 MT/s dual channel DDR4 memory interface for up to 48GB SODIMM ECC memory.
Одномодульные компьютеры COM Express Type 7 Basic module with Intel Atom C3808 processor with 8 Cores, 2.0 GHz core frequency, 16MB Cache, Intel Cache Allocation Technology and 2133 MT/s dual channel DDR4 memory interface for up to 48GB SODIMM ECC memory.
Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are M2.5mm thread.
Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Радиаторы Standard heatspreader for high performance COM Express Type 7 module conga-TSXD with integrated vapor chamber. All standoffs are M2.5mm thread.
